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Defect-limited yield · 5 models · live curve

Wafer Yield Console

Drag die area or defect density and watch yield move along the curve in real time, across all five standard models — Poisson, Murphy, negative-binomial (clustering), Seeds and Bose–Einstein. The clustering-aware negative-binomial is the fab sign-off standard; the rest show the spread.

01 · Quick estimate

Die area + defect density → yield, instantly.

Negative binomial yield
92.3%
A·D0 = 0.081 defects/die
92%YIELD
Full model analysis ↓
02 · Deep analysis

Yield-vs-area console

Yield curve
marker = your die
Yield versus die area for the selected models0%25%50%75%100%die area (cm²) →
Poisson Murphy Negative binomial Seeds Bose–Einstein
Primary model
Negative binomial yield
92.3%
Net good dies
702
of 760 gross
All models
  • Poisson92.2%
  • Murphy92.3%
  • Negative binomial (α=3)92.3%
  • Seeds92.5%
  • Bose–Einstein (n=12)39.3%
MATURE YIELDDefect-limited yield is high — this die size and defect density are well matched for volume production.|Poisson 92% vs NB 92% — a 0-pt clustering gap.Next: cost per good die.
Reference

The five yield models

ModelFormulaBest for
PoissonY = e^(−A·D0)Quick pessimistic bound; random defects.
Murphy((1−e^(−A·D0))/(A·D0))²Classic; averages a triangular D0 spread.
Negative binomial(1 + A·D0/α)^(−α)Fab standard; α fits real clustering.
Seeds1/(1 + A·D0)Heavy-clustering limit (α → 1).
Bose–Einstein1/(1 + A·D0)^nMulti-layer; n = critical mask layers.
Why it matters

Where the money is

Yield is half of cost-per-die

Cost-per-good-die = wafer cost ÷ (dies × yield). A drop from 80% to 60% yield raises the cost of every shipped chip by a third — before anything else changes.

Defect density falls along a learning curve

A node launches near D0 ≈ 0.3 and marches toward 0.05 over a couple of years. The same die that yields 50% at launch can yield 85% at maturity — pure profit, no redesign.

Big dies are doubly punished

Yield falls exponentially with area: double the area and the chance of a killer defect roughly squares. A reticle-limit AI die yields far worse than a mobile SoC on the same line.

Real defects cluster — pick the right model

Poisson assumes perfectly random defects and is pessimistic; the negative-binomial model with a clustering factor α matches measured fab data far better — the gap can be 10+ points of yield.

Field notes

Yield: the number that decides whether a chip is a business

Two fabs can run the same design on the same node and one makes money while the other doesn't — the difference is yield. Of all the levers in chip economics, the fraction of dies that actually work most directly turns a wafer's fixed cost into sellable product, and it's the one engineers can move most.

The foundation is one elegant idea: if killer defects land randomly at an average rate, the chance a die escapes them all follows the Poisson distribution — Yield = e^(−A·D0), where A·D0 is the mean defects per die. It's clean and slightly wrong, because real defects cluster. Capturing that is what Murphy's triangular average and especially the negative-binomial model (with an explicit clustering parameter α) do — and the gap between Poisson and a calibrated negative binomial can be ten points of yield, the difference between a viable product and a canceled one.

Die size dominates because of the exponential: a die that yields 90% at 1 cm² yields ~67% at 4. That's why a reticle-limit AI accelerator has brutal economics where a mobile SoC prints money, and the strongest argument for chiplets. Yield is also a curve over time — a new node improves along a learning curve as the fab hunts defects, so the same design gets cheaper to make every quarter with no redesign.

Use this as the second leg of the cost tripod: Die Per Wafer gives the gross count, this gives the working fraction, and multiplying them feeds Wafer Cost — the figure that actually matters: cost per good chip.

Wafer Yield FAQs

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Trusted by Yield, Process & Cost Teams

4.8
Based on 3,960 reviews

Finally a yield tool that shows all the models side by side on a live curve. Toggling Poisson vs negative-binomial with our α makes the clustering point land instantly with design teams. Matches our internal sign-off numbers.

D
Dr. Hiroshi Tanaka
Yield engineering manager, logic foundry
April 30, 2026

The yield-vs-area curve is exactly the picture I draw on whiteboards, now live. Dragging D0 and watching our die move along the curve made the defect-reduction roadmap concrete for the whole team.

E
Elena Petrova
Process integration engineer
March 18, 2026

Pairs perfectly with the die-per-wafer console. Gross × this yield × wafer cost gives cost-per-good-die in under a minute across nodes. The reality anchors connect yield to dollars better than my old spreadsheet.

M
Marcus Bauer
Fabless cost modeling lead
February 5, 2026

Clean, fast, genuinely educational. For memory I'd love a redundancy-uplift input, but as a defect-limited baseline across Poisson/Murphy/NB it's the best free option I've found.

P
Priya Deshmukh
Memory test engineer
December 12, 2025

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Defect-limited yield models (Murphy 1964; Stapper negative-binomial) · Last reviewed: 2026-06